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 ADVANCE INFORMATION
GALVANTECH, INC. SYNCHRONOUS CACHE TAG SRAM PIPELINED OUTPUT
FEATURES
* * * * * * * * * * * * * * Fast match times: 4.5, 5.0, 6.0, and 7.0ns Fast clock speed: 133, 100, 83, and 75 MHz Fast OE# access times: 4.5ns and 5.0ns Pipelined data comparator Data input register load control by DEN# 3.3V -5% and +10% power supply 5V tolerant inputs except I/O's Clamp diodes to VSS at all inputs and outputs Common data inputs and data outputs Two chip enables for depth expansion Address, data and control registers Internally self-timed WRITE CYCLE Automatic power-down for portable applications Low profile 119 lead, 14mm x 22mm BGA (Ball Grid Array) and 100 pin TQFP packages
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
64K x 18 SRAM
+3.3V SUPPLY WITH CLOCKED REGISTERED INPUTS
GENERAL DESCRIPTION
The Galvantech Synchronous SRAM family employs high-speed, low power CMOS designs using advanced triplelayer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high valued resistors. The GVT7164T18 SRAM integrates 65,536 x 18 SRAM cells with advanced synchronous peripheral circuitry and a 18-bit comparator for tag compare operation. All synchronous inputs are gated by registers controlled by a positive-edgetriggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, depth-expansion chip enables (CE# and CE1), write enable (WE#), and data input enable (DEN#). Asynchronous inputs include the output enable (OE#) and the match output enable (MOE#). The data outputs (Q) and match output (MATCH), enabled by OE# and MOE# respectively, are also asynchronous. Data inputs are registered with data input enable (DEN#) and chip enable pins (CE#, CE1). The outputs of the data input registers are compared with data in the memory array and a match signal is generated. The match output is gated into a pipeline register and released to the match output pin at the next rising edge of clock (CLK). The GVT7164T18 operates from a +3.3V power supply. All inputs and outputs are LVTTL compatible. The device is ideally suited for address tag RAM for up to 2 MB secondary cache.
OPTIONS
* Timing 4.5ns access/7.5ns cycle 5.0ns access/10ns cycle 6.0ns access/12ns cycle 7.0ns access/13.3ns cycle Packages 119-lead BGA 100-pin TQFP
MARKING
-4 -5 -6 -7 B T
*
Galvantech, Inc. 3080 Oakmead Village Drive, Santa Clara, CA 95051 Tel (408) 566-0688 Fax (408) 566-0699 Web Site http://www.galvantech.com
Rev. 11/97
Galvantech, Inc. reserves the right to change products or specifications without notice.
ADVANCE INFORMATION
GALVANTECH, INC.
FUNCTIONAL BLOCK DIAGRAM
WRITE
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
WE#
D
Q
D
Q
OE# MATCH MOE#
D
Q
CE# CE1 Latch
ENABLE
D
Q
Compare
DEN# Latch A CLK 16 Address Register
Input Register
64K x 9 x 2 SRAM Array
OUTPUT REGISTER
Output Buffers
D
Q
DQ1DQ18
NOTE:
The Functional Block Diagram illustrates simplified device operation. See Truth Table, pin descriptions and timing diagrams for detailed information.
November 5, 1997
2
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
PIN ASSIGNMENTS (TOP VIEW)
1 A B C D E F G H J K L M N P R T U
VCC
2 A
3 A
4
NC NC
5 A
6
7
A A CE# CE1 NC NC NC NC NC VCC VSS CLK NC WE# OE# NC NC NC A A
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66
NC VCC
NC NC NC VCC VSS NC NC DQ10 DQ11 VSS VCC DQ12 DQ13 NC VCC NC VSS DQ14 DQ15 VCC VSS DQ16 DQ17 DQ18 NC VSS VCC NC NC NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
NC CE1 NC NC
DQ10
NC CE# NC
NC
NC VCC
A
A
NC
NC VSS NC VSS DQ9 NC
NC DQ11 VSS NC VSS NC DQ8
VCC
NC VSS OE# VSS DQ7 VCC NC VSS NC DQ6
NC DQ12 NC
DQ13
100-pin TQFP
65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
NC VSS WE# VSS DQ5 NC NC VCC NC VCC VCC
VCC VCC
NC DQ14 VSS CLK VSS NC DQ4
DQ15
NC VSS NC
NC DQ3 NC
VCC DQ16 VSS DQ17
NC VSS NC VCC
A NC NC VCC VSS NC DQ9 DQ8 DQ7 VSS VCC DQ6 DQ5 VSS NC VCC NC DQ4 DQ3 VCC VSS DQ2 DQ1 NC NC VSS VCC NC NC NC
NC VSS
A A
VCC
MATCH
VSS DQ2 NC VSS NC DQ1
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
NC DQ18 VSS NC NC
VCC
A A
DEN#
A A
NC
A A
MOE#
A A
NC NC
A
NC VCC
TOP VIEW 119 LEAD BGA
November 5, 1997
3
Rev. 11/97
NC A A A A A A VSS MATCH VSS VCC DEN# MOE# A A A A A NC NC
Galvantech, Inc. reserves the right to change products or specifications without notice.
ADVANCE INFORMATION
GALVANTECH, INC.
PIN DESCRIPTIONS
BGA PINS TQFP PINS SYMBOL
A
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
TYPE
Input-
DESCRIPTION
2A, 3A, 5A, 5C, 6C, 4N, 37, 36, 35, 34, 33, 32, 100, 4P, 2R, 3R, 5R, 6R, 2T, 3T, 99, 82, 81, 80, 48, 47, 46, 5T, 6T, 4U 45, 44 4H 87
Addresses: These inputs are registered and must meet the Synchronous setup and hold times around the rising edge of CLK. InputWrite Enable: this write enable is LOW for a WRITE cycle one cycle after WE#=LOW is gated into register.
WE#
Synchronous and HIGH for a READ cycle. Data I/O are high impedance
4K
89
CLK
Input-
Clock: This signal registers the addresses, data, chip its rising edge. All synchronous inputs must meet setup and hold times around the clock's rising edge.
Synchronous enables, write control and data input enable control input on
6B 2B 4F 2U 4T
98 97 86 42 39
CE# CE1 OE# DEN# MATCH
InputinputInput InputOutput
Chip Enable: This active LOW input is used to enable the Chip enable: This active HIGH input is used to enable the Output Enable: This active LOW asynchronous input enables the data output drivers. Data Input Enable: This active LOW input is used to control Match Output: MATCH will be HIGH if data in the data input registers match the data stored in the memory array, assuming MOE# being LOW. MATCH will be LOW if data do not match. Match Output Enable: This active LOW asynchronous input enables the MATCH output drivers. Data Inputs/Outputs: Input data must meet setup and hold times around the rising edge of CLK. Power Supply: +3.3V -5% and +10%
Synchronous device. Synchronous device.
Synchronous the update of data input registers.
5U
43
MOE# DQ1-DQ18
Input Input/ Output Supply
7P, 6N, 6L, 7K, 6H, 7G, 6F, 58, 59, 62, 63, 68, 69, 72, 7E, 6D, 1D, 2E, 2G, 1H, 73, 74, 8, 9, 12, 13, 18, 19, 2K, 1L, 2M, 1N, 2P 22, 23, 24 1A, 7A, 4C, 1F, 7F, 1J, 2J, 4J, 6J, 7J, 1M, 7M, 4R, 1U, 7U 3D, 5D, 3E, 5E, 3F, 5F, 5G, 3H, 5H, 3K, 5K, 3L, 3M, 5M, 3N, 5N, 3P, 5P 4A, 6A, 1B, 3B, 4B, 5B, 7B, 1C, 2C, 3C, 7C, 2D, 4D, 7D, 1E, 4E, 6E, 2F, 1G, 3G, 4G, 6G, 2H, 7H, 3J, 5J, 1K, 6K, 2L, 4L, 5L, 7L, 4M, 6M, 2N, 7N, 1P, 6P, 1R, 7R, 1T, 7T, 3U, 6U 4, 11, 15, 20, 27, 41, 54, 61, 65, 70, 77, 91 5, 10, 17, 21, 26, 38, 40, 55, 60, 67, 71, 76, 90 1-3, 6, 7, 14, 16, 25, 2831, 49-53, 56, 57, 64, 66, 75, 78, 79, 83-85, 88, 9296
VCC
VSS
Ground
Ground: GND.
NC
-
No Connect: These signals are not internally connected.
November 5, 1997
4
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
TRUTH TABLE
OPERATION E# WE# DEN# MOE##
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
OE#
MATCH
DQ
READ Cycle WRITE Cycle Fill WRITE Cycle COMPARE Cycle Deselected Cycle (MATCH Out) Deselected Cycle
L L L L H H
H L L H X X
X L H L X X
X X X L L H
L H H H X X
Output H High-Z
Q D High-Z D High-Z High-Z
Note:
1. 2. 3. 4. 5.
X means "don't care." H means logic HIGH. L means logic LOW. E# =L is defined as CE#=LOW and CE1=HIGH. E# =H is defined as CE#=HIGH or CE1=LOW. All inputs except OE# and MOE# must meet setup and hold times around the rising edge (LOW to HIGH) of CLK. For a write operation following a read operation, OE# must be HIGH before the input data required setup time plus High-Z time for OE# and staying HIGH throughout the input data hold time. This device contains circuitry that will ensure the outputs will be in High-Z during power-up.
THERMAL CHARACTERISTICS
DESCRIPTION
Thermal Resistance - Junction to Ambient Thermal Resistance - Junction to Case
CONDITIONS
Still air, soldered on 4.25 x 1.125 inch 4-layer PCB
SYMBOL
JA JC
BGA TYP
19 9
TQFP TYP
25 9
UNITS
oC/W oC/W
NOTES
November 5, 1997
5
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
ABSOLUTE MAXIMUM RATINGS*
Voltage on VCC Supply Relative to VSS........-0.5V to +4.6V VIN ...........................................................-0.5V to VCC+0.5V Storage Temperature (plastic) ..........................-55oC to +150o Junction Temperature .....................................................+150o Power Dissipation ............................................................1.0W Short Circuit Output Current ..........................................50mA
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
*Stresses greater than those listed uunder "Absolute Maximum Ratings" may cause permanent damage to the device.This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS
(0oC Ta
70C; VCC = 3.3V -5% and +10% unless otherwise noted)
CONDITIONS
Data Inputs (DQxx) All Other Inputs
DESCRIPTION
Input High (Logic 1) voltage Input Low (Logic 0) Voltage Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Supply Voltage
SYMBOL
VIHD VIH VIl ILI ILO VOH VOL VCC
MIN
2.0 2.0 -0.5 -1 -1 2.4
MAX
VCC+0.5 4.6 0.8 1 1 0.4
UNITS
V V V uA uA V V V
NOTES
1,2 1,2 1, 2 14 1, 11 1, 11 1
0V < VIN < VCC Output(s) disabled, 0V < VOUT < VCC IOH = -4.0mA IOL =8.0mA
3.135
3.6
DESCRIPTION
Power Supply Current: Operating CMOS Standby
CONDITIONS
Device selected; all inputs < VILor > VIH;cycle time > tKC MIN; VCC =MAX; outputs open Device deselected; VCC = MAX; all inputs < VSS +0.2 or >VCC -0.2; all inputs static; CLK frequency = 0 Device deselected; all inputs < VIL or > VIH ; all inputs static; VCC = MAX; CLK frequency = 0 Device deselected; all inputs < VIL or > VIH; VCC = MAX; CLK cycle time > tKC MIN
SYM
Icc
TYP
150
-4
300
-5
240
-6
220
-7
200
UNITS NOTES
mA 3, 12, 13
ISB2
5
10
10
10
10
mA
12,13
TTL Standby
ISB3
10
20
20
20
20
mA
12,13
Clock Running
ISB4
40
80
70
60
50
mA
12,13
November 5, 1997
6
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
AC ELECTRICAL CHARACTERISTICS
(Note 5) (0oC
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
TA 70oC; VCC = 3.3V -5% and +10%)
-4 133MHz
SYM MIN MAX
DESCRIPTION
Clock Clock cycle time Clock HIGH time Clock LOW time Output Times Clock to output valid Clock to MATCH valid Clock to output invalid Clock to MATCH invalid Clock to output in Low-Z Clock to output in High-Z OE to output valid MOE to MATCH valid OE to output in Low-Z MOE to MATCH in Low-Z OE to output in High-Z MOE to MATCH in High-Z Setup Times Address, Controls and Data In Hold Times Address, Controls and Data In
t t t t t t t t t t t t t
-5 100MHz
MIN MAX
-6 83MHz
MIN MAX
-7 75MHz
MIN MAX UNITS NOTES
KC KH KL
7.5 3.0 3.0 4.5 4.5 1.5 1.5 0 1.5 5.0 4.5 4.5 0 0 4.5 4.5 2.0 0.5
10 3.5 3.5 5.0 5.0 1.5 1.5 0 1.5 5.0 5.0 5.0 0 0 5.0 5.0 2.5 0.5
12 4.0 4.0 6.0 6.0 1.5 1.5 0 1.5 5.0 5.0 5.0 0 0 5.0 5.0 2.5 0.5
13.3 4.5 4.5 7.0 7.0 1.5 1.5 0 1.5 5.0 5.0 5.0 0 0 5.0 5.0 2.5 0.5
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 4, 6,7 4, 6,7 9 9 4, 6,7 4, 6,7 4, 6,7 4, 6,7 10 10
t
KQ
KM
KQX
KMX
KQLZ OEQ
KQHZ
t
MOEM
t
OELZ
MOELZ
t
OEHZ
MOEHZ S
H
CAPACITANCE
DESCRIPTION
Input Capacitance Input/Output Capacitance (DQ)
CONDITIONS
TA = 25oC; f = 1 MHz VCC = 3.3V
SYMBOL
CI CO
TYP
4 7
MAX
5 8
UNITS
pF pF
NOTES
4 4
TYPICAL OUTPUT BUFFER CHARACTERISTICS
OUTPUT HIGH VOLTAGE
VOH (V) -0.5 0 0.8 1.25 1.5 2.3 2.7 2.9 3.4
PULL-UP CURRENT
(m) in (m) ax -38 -38 -38 -26 -20 0 0 0 0 -105 -105 -105 -83 -70 -30 -10 0 0
OUTPUT LOW VOLTAGE
VOL (V) -0.5 0 0.4 0.8 1.25 1.6 2.8 3.2 3.4
PULL-DOWN CURRENT
L(m) in L(m) ax 0 0 10 20 31 40 40 40 40 0 0 20 40 63 80 80 80 80
November 5, 1997
7
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
AC TEST CONDITIONS Input pulse levels Input rise/fall time Input timing reference levels Output reference levels 0V to 3.0V 3 ns 1.5V 1.5V
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
OUTPUT LOADS
DQ Z0 = 50 50 Vt = 1.5V Fig. 1 OUTPUT LOAD EQUIVALENT 3.3v 317 DQ 351 5 pF
Fig. 2 OUTPUT LOAD EQUIVALENT
NOTES
1. 2. 3. 4. 5. 6. 7. All voltages referenced to VSS (GND). Overshoot: Undershoot: VIH +6.0V for t tKC /2. VIL -2.0V for t tKC /2
14. Capacitance derating applies to capacitance different from the load capacitance shown in Fig. 1.
Icc is given with no output current. Icc increases with greater output loading and faster cycle times. This parameter is sampled. Test conditions as specified with the output loading as shown in Fig. 1 unless otherwise noted. Output loading is specified with CL=5pF as in Fig. 2. At any given temperature and voltage condition, tKQHZ is less than tKQLZ, tOEHZ is less than tOELZ and tMOEHZ is less than tMOELZ. A READ cycle is defined by write enable (WE#) HIGH along with chip enables being active for the required setup and hold times. A WRITE cycle is defined by write enable (WE#) LOW along with chip enables being active for the required setup and hold times. OE# is a "don't care" when a write enable (WE#) is sampled LOW.
8.
9.
10. This is a synchronous device. All synchronous inputs must meet specified setup and hold time, except for "don't care" as defined in the truth table. 11. AC I/O curves are available upon request. 12. "Device Deselected" means the device is in POWER -DOWN mode as defined in the truth table. "Device Selected" means the device is active. 13. Typical values are measured at 3.3V, 25oC and 20ns cycle time.
November 5, 1997
8
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
READ/WRITE TIMING
tKH tKC tKL
CLK
tS
ADDRESS
A1
A2
tH
A3
A4
A5
A6
A7
A8
WE# CE# (See Note) DEN#
tOEQ tOEHZ
OE#
tOELZ tKQLZ tKQ tKQX
tKQHZ
DQ
Q(A1)
Q(A2)
Q(A3)
Q(A4)
D(A5)
D(A6)
D(A7)
D(A8)
Reads
Note: CE# active in this timing diagram means that all chip enables CE# and CE1 are active.
Writes
November 5, 1997
9
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
COMPARE/FILL WRITE TIMING
tKH tKC tKL
CLK
tS
ADDRESS
A1
tH
A1
A2
WE# CE# (See Note) DEN#
OE#
DQ
D(A1)
tMOEHZ t
D(A2)
tMOEM
KM
MOE#
tMOELZ
MATCH HIGH CHIP DESELECTED
MATCH
tKMX
MISS
FILL WRITE
HIT
Note: CE# active in this timing diagram means that all chip enables CE# and CE1 are active.
November 5, 1997
10
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
100 Pin TQFP Package Dimensions
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
16.00 + 0.10 14.00 + 0.10
#1
20.00 + 0.10
22.00 + 0.10
1.40 + 0.05
1.60 Max Note: All dimensions in Millimeters
November 5, 1997
0.65 Basic
0.30 + 0.08
0.60 + 0.15
11
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
ADVANCE INFORMATION
GALVANTECH, INC.
7 x 17 (119-lead) BGA Dimensions
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
22.00 + 0.20 20.32 1.27
7 6
14.00 + 0.20
5
7.62
4 3 2 1
1.27
UT R P NML KJ
HGFEDCBA
o 0.75+0.15 (119X)
BOTTOM VIEW
19.50 + 0.10
12.00 + 0.10
0.70 REF.
0.90 + 0.10
30 TYP.
0.56 REF.
0.60 + 0.10
SIDE VIEW
Note: All dimensions in Millimeters
November 5, 1997
12
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97
2.40 MAX.
PIN 1A CORNER
TOP VIEW
ADVANCE INFORMATION
GALVANTECH, INC.
Ordering Information
GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM
GVT 7164T18 X - X
Galvantech Prefix Part Number Speed (4 = 4.5ns access/7.5ns cycle 5 = 5.0ns access/10ns cycle 6 =6.0ns access/12ns cycle 7 = 7.0ns access/13.3ns cycle) Package (T = 100 PIN TQFP B = 119 LEAD BGA)
November 5, 1997
13
Galvantech, Inc. reserves the right to change products or specifications without notice.
Rev. 11/97


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