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ADVANCE INFORMATION GALVANTECH, INC. SYNCHRONOUS CACHE TAG SRAM PIPELINED OUTPUT FEATURES * * * * * * * * * * * * * * Fast match times: 4.5, 5.0, 6.0, and 7.0ns Fast clock speed: 133, 100, 83, and 75 MHz Fast OE# access times: 4.5ns and 5.0ns Pipelined data comparator Data input register load control by DEN# 3.3V -5% and +10% power supply 5V tolerant inputs except I/O's Clamp diodes to VSS at all inputs and outputs Common data inputs and data outputs Two chip enables for depth expansion Address, data and control registers Internally self-timed WRITE CYCLE Automatic power-down for portable applications Low profile 119 lead, 14mm x 22mm BGA (Ball Grid Array) and 100 pin TQFP packages GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM 64K x 18 SRAM +3.3V SUPPLY WITH CLOCKED REGISTERED INPUTS GENERAL DESCRIPTION The Galvantech Synchronous SRAM family employs high-speed, low power CMOS designs using advanced triplelayer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high valued resistors. The GVT7164T18 SRAM integrates 65,536 x 18 SRAM cells with advanced synchronous peripheral circuitry and a 18-bit comparator for tag compare operation. All synchronous inputs are gated by registers controlled by a positive-edgetriggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, depth-expansion chip enables (CE# and CE1), write enable (WE#), and data input enable (DEN#). Asynchronous inputs include the output enable (OE#) and the match output enable (MOE#). The data outputs (Q) and match output (MATCH), enabled by OE# and MOE# respectively, are also asynchronous. Data inputs are registered with data input enable (DEN#) and chip enable pins (CE#, CE1). The outputs of the data input registers are compared with data in the memory array and a match signal is generated. The match output is gated into a pipeline register and released to the match output pin at the next rising edge of clock (CLK). The GVT7164T18 operates from a +3.3V power supply. All inputs and outputs are LVTTL compatible. The device is ideally suited for address tag RAM for up to 2 MB secondary cache. OPTIONS * Timing 4.5ns access/7.5ns cycle 5.0ns access/10ns cycle 6.0ns access/12ns cycle 7.0ns access/13.3ns cycle Packages 119-lead BGA 100-pin TQFP MARKING -4 -5 -6 -7 B T * Galvantech, Inc. 3080 Oakmead Village Drive, Santa Clara, CA 95051 Tel (408) 566-0688 Fax (408) 566-0699 Web Site http://www.galvantech.com Rev. 11/97 Galvantech, Inc. reserves the right to change products or specifications without notice. ADVANCE INFORMATION GALVANTECH, INC. FUNCTIONAL BLOCK DIAGRAM WRITE GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM WE# D Q D Q OE# MATCH MOE# D Q CE# CE1 Latch ENABLE D Q Compare DEN# Latch A CLK 16 Address Register Input Register 64K x 9 x 2 SRAM Array OUTPUT REGISTER Output Buffers D Q DQ1DQ18 NOTE: The Functional Block Diagram illustrates simplified device operation. See Truth Table, pin descriptions and timing diagrams for detailed information. November 5, 1997 2 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM PIN ASSIGNMENTS (TOP VIEW) 1 A B C D E F G H J K L M N P R T U VCC 2 A 3 A 4 NC NC 5 A 6 7 A A CE# CE1 NC NC NC NC NC VCC VSS CLK NC WE# OE# NC NC NC A A 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 NC VCC NC NC NC VCC VSS NC NC DQ10 DQ11 VSS VCC DQ12 DQ13 NC VCC NC VSS DQ14 DQ15 VCC VSS DQ16 DQ17 DQ18 NC VSS VCC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 NC CE1 NC NC DQ10 NC CE# NC NC NC VCC A A NC NC VSS NC VSS DQ9 NC NC DQ11 VSS NC VSS NC DQ8 VCC NC VSS OE# VSS DQ7 VCC NC VSS NC DQ6 NC DQ12 NC DQ13 100-pin TQFP 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 NC VSS WE# VSS DQ5 NC NC VCC NC VCC VCC VCC VCC NC DQ14 VSS CLK VSS NC DQ4 DQ15 NC VSS NC NC DQ3 NC VCC DQ16 VSS DQ17 NC VSS NC VCC A NC NC VCC VSS NC DQ9 DQ8 DQ7 VSS VCC DQ6 DQ5 VSS NC VCC NC DQ4 DQ3 VCC VSS DQ2 DQ1 NC NC VSS VCC NC NC NC NC VSS A A VCC MATCH VSS DQ2 NC VSS NC DQ1 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NC DQ18 VSS NC NC VCC A A DEN# A A NC A A MOE# A A NC NC A NC VCC TOP VIEW 119 LEAD BGA November 5, 1997 3 Rev. 11/97 NC A A A A A A VSS MATCH VSS VCC DEN# MOE# A A A A A NC NC Galvantech, Inc. reserves the right to change products or specifications without notice. ADVANCE INFORMATION GALVANTECH, INC. PIN DESCRIPTIONS BGA PINS TQFP PINS SYMBOL A GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM TYPE Input- DESCRIPTION 2A, 3A, 5A, 5C, 6C, 4N, 37, 36, 35, 34, 33, 32, 100, 4P, 2R, 3R, 5R, 6R, 2T, 3T, 99, 82, 81, 80, 48, 47, 46, 5T, 6T, 4U 45, 44 4H 87 Addresses: These inputs are registered and must meet the Synchronous setup and hold times around the rising edge of CLK. InputWrite Enable: this write enable is LOW for a WRITE cycle one cycle after WE#=LOW is gated into register. WE# Synchronous and HIGH for a READ cycle. Data I/O are high impedance 4K 89 CLK Input- Clock: This signal registers the addresses, data, chip its rising edge. All synchronous inputs must meet setup and hold times around the clock's rising edge. Synchronous enables, write control and data input enable control input on 6B 2B 4F 2U 4T 98 97 86 42 39 CE# CE1 OE# DEN# MATCH InputinputInput InputOutput Chip Enable: This active LOW input is used to enable the Chip enable: This active HIGH input is used to enable the Output Enable: This active LOW asynchronous input enables the data output drivers. Data Input Enable: This active LOW input is used to control Match Output: MATCH will be HIGH if data in the data input registers match the data stored in the memory array, assuming MOE# being LOW. MATCH will be LOW if data do not match. Match Output Enable: This active LOW asynchronous input enables the MATCH output drivers. Data Inputs/Outputs: Input data must meet setup and hold times around the rising edge of CLK. Power Supply: +3.3V -5% and +10% Synchronous device. Synchronous device. Synchronous the update of data input registers. 5U 43 MOE# DQ1-DQ18 Input Input/ Output Supply 7P, 6N, 6L, 7K, 6H, 7G, 6F, 58, 59, 62, 63, 68, 69, 72, 7E, 6D, 1D, 2E, 2G, 1H, 73, 74, 8, 9, 12, 13, 18, 19, 2K, 1L, 2M, 1N, 2P 22, 23, 24 1A, 7A, 4C, 1F, 7F, 1J, 2J, 4J, 6J, 7J, 1M, 7M, 4R, 1U, 7U 3D, 5D, 3E, 5E, 3F, 5F, 5G, 3H, 5H, 3K, 5K, 3L, 3M, 5M, 3N, 5N, 3P, 5P 4A, 6A, 1B, 3B, 4B, 5B, 7B, 1C, 2C, 3C, 7C, 2D, 4D, 7D, 1E, 4E, 6E, 2F, 1G, 3G, 4G, 6G, 2H, 7H, 3J, 5J, 1K, 6K, 2L, 4L, 5L, 7L, 4M, 6M, 2N, 7N, 1P, 6P, 1R, 7R, 1T, 7T, 3U, 6U 4, 11, 15, 20, 27, 41, 54, 61, 65, 70, 77, 91 5, 10, 17, 21, 26, 38, 40, 55, 60, 67, 71, 76, 90 1-3, 6, 7, 14, 16, 25, 2831, 49-53, 56, 57, 64, 66, 75, 78, 79, 83-85, 88, 9296 VCC VSS Ground Ground: GND. NC - No Connect: These signals are not internally connected. November 5, 1997 4 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. TRUTH TABLE OPERATION E# WE# DEN# MOE## GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM OE# MATCH DQ READ Cycle WRITE Cycle Fill WRITE Cycle COMPARE Cycle Deselected Cycle (MATCH Out) Deselected Cycle L L L L H H H L L H X X X L H L X X X X X L L H L H H H X X Output H High-Z Q D High-Z D High-Z High-Z Note: 1. 2. 3. 4. 5. X means "don't care." H means logic HIGH. L means logic LOW. E# =L is defined as CE#=LOW and CE1=HIGH. E# =H is defined as CE#=HIGH or CE1=LOW. All inputs except OE# and MOE# must meet setup and hold times around the rising edge (LOW to HIGH) of CLK. For a write operation following a read operation, OE# must be HIGH before the input data required setup time plus High-Z time for OE# and staying HIGH throughout the input data hold time. This device contains circuitry that will ensure the outputs will be in High-Z during power-up. THERMAL CHARACTERISTICS DESCRIPTION Thermal Resistance - Junction to Ambient Thermal Resistance - Junction to Case CONDITIONS Still air, soldered on 4.25 x 1.125 inch 4-layer PCB SYMBOL JA JC BGA TYP 19 9 TQFP TYP 25 9 UNITS oC/W oC/W NOTES November 5, 1997 5 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. ABSOLUTE MAXIMUM RATINGS* Voltage on VCC Supply Relative to VSS........-0.5V to +4.6V VIN ...........................................................-0.5V to VCC+0.5V Storage Temperature (plastic) ..........................-55oC to +150o Junction Temperature .....................................................+150o Power Dissipation ............................................................1.0W Short Circuit Output Current ..........................................50mA GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM *Stresses greater than those listed uunder "Absolute Maximum Ratings" may cause permanent damage to the device.This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS (0oC Ta 70C; VCC = 3.3V -5% and +10% unless otherwise noted) CONDITIONS Data Inputs (DQxx) All Other Inputs DESCRIPTION Input High (Logic 1) voltage Input Low (Logic 0) Voltage Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Supply Voltage SYMBOL VIHD VIH VIl ILI ILO VOH VOL VCC MIN 2.0 2.0 -0.5 -1 -1 2.4 MAX VCC+0.5 4.6 0.8 1 1 0.4 UNITS V V V uA uA V V V NOTES 1,2 1,2 1, 2 14 1, 11 1, 11 1 0V < VIN < VCC Output(s) disabled, 0V < VOUT < VCC IOH = -4.0mA IOL =8.0mA 3.135 3.6 DESCRIPTION Power Supply Current: Operating CMOS Standby CONDITIONS Device selected; all inputs < VILor > VIH;cycle time > tKC MIN; VCC =MAX; outputs open Device deselected; VCC = MAX; all inputs < VSS +0.2 or >VCC -0.2; all inputs static; CLK frequency = 0 Device deselected; all inputs < VIL or > VIH ; all inputs static; VCC = MAX; CLK frequency = 0 Device deselected; all inputs < VIL or > VIH; VCC = MAX; CLK cycle time > tKC MIN SYM Icc TYP 150 -4 300 -5 240 -6 220 -7 200 UNITS NOTES mA 3, 12, 13 ISB2 5 10 10 10 10 mA 12,13 TTL Standby ISB3 10 20 20 20 20 mA 12,13 Clock Running ISB4 40 80 70 60 50 mA 12,13 November 5, 1997 6 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. AC ELECTRICAL CHARACTERISTICS (Note 5) (0oC GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM TA 70oC; VCC = 3.3V -5% and +10%) -4 133MHz SYM MIN MAX DESCRIPTION Clock Clock cycle time Clock HIGH time Clock LOW time Output Times Clock to output valid Clock to MATCH valid Clock to output invalid Clock to MATCH invalid Clock to output in Low-Z Clock to output in High-Z OE to output valid MOE to MATCH valid OE to output in Low-Z MOE to MATCH in Low-Z OE to output in High-Z MOE to MATCH in High-Z Setup Times Address, Controls and Data In Hold Times Address, Controls and Data In t t t t t t t t t t t t t -5 100MHz MIN MAX -6 83MHz MIN MAX -7 75MHz MIN MAX UNITS NOTES KC KH KL 7.5 3.0 3.0 4.5 4.5 1.5 1.5 0 1.5 5.0 4.5 4.5 0 0 4.5 4.5 2.0 0.5 10 3.5 3.5 5.0 5.0 1.5 1.5 0 1.5 5.0 5.0 5.0 0 0 5.0 5.0 2.5 0.5 12 4.0 4.0 6.0 6.0 1.5 1.5 0 1.5 5.0 5.0 5.0 0 0 5.0 5.0 2.5 0.5 13.3 4.5 4.5 7.0 7.0 1.5 1.5 0 1.5 5.0 5.0 5.0 0 0 5.0 5.0 2.5 0.5 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 4, 6,7 4, 6,7 9 9 4, 6,7 4, 6,7 4, 6,7 4, 6,7 10 10 t KQ KM KQX KMX KQLZ OEQ KQHZ t MOEM t OELZ MOELZ t OEHZ MOEHZ S H CAPACITANCE DESCRIPTION Input Capacitance Input/Output Capacitance (DQ) CONDITIONS TA = 25oC; f = 1 MHz VCC = 3.3V SYMBOL CI CO TYP 4 7 MAX 5 8 UNITS pF pF NOTES 4 4 TYPICAL OUTPUT BUFFER CHARACTERISTICS OUTPUT HIGH VOLTAGE VOH (V) -0.5 0 0.8 1.25 1.5 2.3 2.7 2.9 3.4 PULL-UP CURRENT (m) in (m) ax -38 -38 -38 -26 -20 0 0 0 0 -105 -105 -105 -83 -70 -30 -10 0 0 OUTPUT LOW VOLTAGE VOL (V) -0.5 0 0.4 0.8 1.25 1.6 2.8 3.2 3.4 PULL-DOWN CURRENT L(m) in L(m) ax 0 0 10 20 31 40 40 40 40 0 0 20 40 63 80 80 80 80 November 5, 1997 7 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. AC TEST CONDITIONS Input pulse levels Input rise/fall time Input timing reference levels Output reference levels 0V to 3.0V 3 ns 1.5V 1.5V GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM OUTPUT LOADS DQ Z0 = 50 50 Vt = 1.5V Fig. 1 OUTPUT LOAD EQUIVALENT 3.3v 317 DQ 351 5 pF Fig. 2 OUTPUT LOAD EQUIVALENT NOTES 1. 2. 3. 4. 5. 6. 7. All voltages referenced to VSS (GND). Overshoot: Undershoot: VIH +6.0V for t tKC /2. VIL -2.0V for t tKC /2 14. Capacitance derating applies to capacitance different from the load capacitance shown in Fig. 1. Icc is given with no output current. Icc increases with greater output loading and faster cycle times. This parameter is sampled. Test conditions as specified with the output loading as shown in Fig. 1 unless otherwise noted. Output loading is specified with CL=5pF as in Fig. 2. At any given temperature and voltage condition, tKQHZ is less than tKQLZ, tOEHZ is less than tOELZ and tMOEHZ is less than tMOELZ. A READ cycle is defined by write enable (WE#) HIGH along with chip enables being active for the required setup and hold times. A WRITE cycle is defined by write enable (WE#) LOW along with chip enables being active for the required setup and hold times. OE# is a "don't care" when a write enable (WE#) is sampled LOW. 8. 9. 10. This is a synchronous device. All synchronous inputs must meet specified setup and hold time, except for "don't care" as defined in the truth table. 11. AC I/O curves are available upon request. 12. "Device Deselected" means the device is in POWER -DOWN mode as defined in the truth table. "Device Selected" means the device is active. 13. Typical values are measured at 3.3V, 25oC and 20ns cycle time. November 5, 1997 8 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM READ/WRITE TIMING tKH tKC tKL CLK tS ADDRESS A1 A2 tH A3 A4 A5 A6 A7 A8 WE# CE# (See Note) DEN# tOEQ tOEHZ OE# tOELZ tKQLZ tKQ tKQX tKQHZ DQ Q(A1) Q(A2) Q(A3) Q(A4) D(A5) D(A6) D(A7) D(A8) Reads Note: CE# active in this timing diagram means that all chip enables CE# and CE1 are active. Writes November 5, 1997 9 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM COMPARE/FILL WRITE TIMING tKH tKC tKL CLK tS ADDRESS A1 tH A1 A2 WE# CE# (See Note) DEN# OE# DQ D(A1) tMOEHZ t D(A2) tMOEM KM MOE# tMOELZ MATCH HIGH CHIP DESELECTED MATCH tKMX MISS FILL WRITE HIT Note: CE# active in this timing diagram means that all chip enables CE# and CE1 are active. November 5, 1997 10 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. 100 Pin TQFP Package Dimensions GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM 16.00 + 0.10 14.00 + 0.10 #1 20.00 + 0.10 22.00 + 0.10 1.40 + 0.05 1.60 Max Note: All dimensions in Millimeters November 5, 1997 0.65 Basic 0.30 + 0.08 0.60 + 0.15 11 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 ADVANCE INFORMATION GALVANTECH, INC. 7 x 17 (119-lead) BGA Dimensions GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM 22.00 + 0.20 20.32 1.27 7 6 14.00 + 0.20 5 7.62 4 3 2 1 1.27 UT R P NML KJ HGFEDCBA o 0.75+0.15 (119X) BOTTOM VIEW 19.50 + 0.10 12.00 + 0.10 0.70 REF. 0.90 + 0.10 30 TYP. 0.56 REF. 0.60 + 0.10 SIDE VIEW Note: All dimensions in Millimeters November 5, 1997 12 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 2.40 MAX. PIN 1A CORNER TOP VIEW ADVANCE INFORMATION GALVANTECH, INC. Ordering Information GVT7164T18 64K X 18 SYNCHRONOUS TAG SRAM GVT 7164T18 X - X Galvantech Prefix Part Number Speed (4 = 4.5ns access/7.5ns cycle 5 = 5.0ns access/10ns cycle 6 =6.0ns access/12ns cycle 7 = 7.0ns access/13.3ns cycle) Package (T = 100 PIN TQFP B = 119 LEAD BGA) November 5, 1997 13 Galvantech, Inc. reserves the right to change products or specifications without notice. Rev. 11/97 |
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